1 sheet no.: d1-a00801en date: november 30, 2007 ?sharp corporation GL100MN3MPx GL100MN3MPx notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the la test device specification sheets before usin g any sharp device. surface mount type, high power output infrared emitting diode features 1. compact and thin smd package 2. top view and side view mountable 3. plastic mold with resin lens 4. peak emission wavelength: 940 nm typ. 5. narrow directivity angle ( ? : 9 typ.) 6. high power output (i e : 6.0 mw/sr typ.) 7. lead free and rohs directive compliant model line-up agency approvals/compliance 1. compliant with rohs directive (2002/95/ec) 2. content information about the six substances specified in ?management methods for control of pollution caused by electronic information prod- ucts regulation? (popular name: china rohs) (chinese: ); refer to page 6. applications 1. office automation equipment 2. audio visual equipment 3. home appliances 4. telecommunication equipment 5. measuring equipment 6. tooling machines 7. computers model no. packaging mount direction GL100MN3MP 2000 pcs/reel side view GL100MN3MP1 1500 pcs/reel top view
sheet no.: d1-a00801en 2 GL100MN3MPx external dimensions 3.0 2.2 0.95 (0.4) 3.0 3.0 1.5 1.5 1.1 1.1 1.4 0. 8 5 1.7 1.1 1.1 1.5 1.5 (0.2) (0.35) 0.4 2.2 1.0 (0.65) 0.75 r0. 8 (0.57) (1.0) (1.0) (0.57) notes: 1. unit: mm 2. unspecified tolerance : 0.2 mm 3. ( ) : reference dimensions 4. a u -plated area 5. do not allo w circ u it r u ns in area (lens center) vie w ed from pcb (side v ie w mo u nting) vie w ed from pcb (top v ie w mo u nting) 1 1 1 2 2 2 anode cathode no. name 0.65 pin arran g ement
sheet no.: d1-a00801en 3 GL100MN3MPx absolute maximum ratings * 1 pulse width: 100 s, duty ratio: 0.01 * 2 10 s (max.) see fig. 4. electro-optical charactertistics parameter symbol rating unit forward current i f 50 ma peak pulsed forward current *1 i fm 0.5 a reverse voltage v r 6 v power dissipation p 75 mw operating temperature topr -30 to +85 c storage temperature tstg -40 to+ 95 c soldering temperature *2 tsol 240 c parameter symbol conditions min. typ. max. unit forward voltage v f i f = 20 ma ? 1.25 1.5 v peak forward voltage v fm i fm = 0.3 a ? 1.9 3.0 v reverse current i r v r = 3 v ??10 a radiant intensity i e i f = 20 ma 3.0 6.0 12.0 mw/sr peak emission wavelength pi f = 5 ma ? 940 ? nm half width spectrum ? i f = 5 ma ? 60 ? nm terminal capacitance c t v r = 0, f = 1 mhz ? 50 ? pf cut-off frequency f c ? ? 300 ? khz half-intensity angle ? ? ? 9 ? degrees (ta = 25c) (ta = 25c)
sheet no.: d1-a00801en 4 GL100MN3MPx fig. 1 foward current vs. ambient temperature fig. 2 radiation diagram 0 10 20 30 40 50 60 -50 -25 0 25 50 75 100 am b ient temperat u re t a (c) for w ard c u rrent i f (ma) 8 5 -30 0 -10 0 +10 +20 -20 -30 -40 -50 -60 -70 - 8 0 -90 +30 +40 +50 +60 +70 + 8 0 +90 angle 100 8 0 60 40 20 relati v e radiant intensity (%) fig. 3 peak forward current vs. duty ratio 10 100 1000 10000 d u ty ratio peak for w ard c u rrent i fm (ma) 10 -4 10 -3 10 -2 10 -1 10 0 p u lse w idth 100 s ta = 25c
sheet no.: d1-a00801en 5 GL100MN3MPx design considerations design guidelines 1. allow for natural degradation of th e led as a result of long continuou s operation. this part will have 50 % deg- radation in output after 5 years of continuous use. 2. this product is not designed to be electroma gnetic- and ionized-particle-radiation resistant. manufacturing guidelines soldering instructions 1. sharp recommends soldering no more than once when using solder reflow methods. 2. when using solder reflow methods, follow reflow soldering temperature profile shown in fig. 4. sharp recom- mends checking the process to make sure these parameters are not exceeded; exceeding these parameters can cause substrate bending or other mechanical stresse s leading to debonding of the internal gold wires, or other similar failure modes. 3. if using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the part's resin. be sure to keep the temperature profile within the guidelines shown in fig. 4. 4. if hand soldering, use temperatures 260 for 3 seconds. do not dip-solder or v ps-solder this part. 5. do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. internal connections may be severed due to mechanical force placed on the pack- age due to the pcb flexing during the soldering process. cleaning instructions 1. confirm this device's resistance to process chemicals be fore use, as certain process chemicals may affect the optical characteristics. 2. solvent cleaning: solvent temperature should be 45c or below. immersion time should be 3 minutes or less. 3. ultrasonic cleaning: the effect upon devices varies d ue to cleaning bath size, ultrasonic power output, cleaning time, pcb size and device mounting circumstances. sharp recommends testing using actual production condi- tions to confirm the harmlessness of the ultrasonic cleaning methods. 4. recommended solvent materials: ethyl alcohol, methyl alcohol, and isopropyl alcohol. fig. 4 reflow solder ing temperature profile 200c 25c 240c max. 120 s max. 90 s max. 60 s max. 10 s max. 165c max. 1 ~ 4 c/s 1 ~ 4 c/s 1 ~ 4c/s
sheet no.: d1-a00801en 6 GL100MN3MPx storage and handling 1. store these parts between 5c and 30c, at a relative humidity of less than 70 % . 2. after breaking the package seal, maintain the environment within 5c to 25c, at a relative humidity of less than 60 % , and mount the parts within two days. if unable to do so, bake before mounting. 3. when storing the parts after breaking the seal, sharp recommends storage of no longer than two weeks in a dry box or by resealing the parts in a moisture-proof bag with a desiccant. if unable to do so, bake before mounting. 4. when baking the parts before mounting, sharp recommends baking the parts only once and only if in a metal tray or mounted on a pcb. recommended conditions are for 16 to 24 hours, at a temperature of 125c. presence of odcs (rohs compliance) this product shall not contain the following materials, and they are not used in the production process for this product: ? regulated substances: cfcs, halon, carbon tetrachlor ide, 1,1,1-trichloroethane (methylchloroform). specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ? lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). ? content information about the six substances specified in ?management methods for control of pollution caused by electronic informatio n products regulation? (chinese: ) note: ? indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the conc entration limit requirement as described in sj/t 11363-2006 standard. taping specifications 1. tape structure and dimensions conforms to those shown in fig. 5 to fig. 10. 2. product insertion will have the catho de to the hole si de of the tape. 3. cover tape peel-separation force: f = 0.2 to 1.0 n (where 160 to 180) 4. quantity per reel = 2000 pcs. (GL100MN3MP) or 1500 pcs. (GL100MN3MP1) 5. product mass: 0.01 g (approx.) 6. packaging: a. reels are sealed inside an aluminum bag, along with a humidity indicator card. b. bags are labeled and securely packed. category toxic and hazdardous substances lead (pb) mercury (hg) cadmium (cd) hexavalent chromiun (cr 6+ ) polybrominated biphenyls (pbb) polybrominated diphenyl ethers (pbde) infrared emitting diode ??????
sheet no.: d1-a00801en 7 GL100MN3MPx packing specifications GL100MN3MP (side view mount, 2000 pcs/reel) fig. 5 tape sh ape and dimension fig. 6 reel shape and dimension 4.0 0.1 2.0 0.05 4.0 0.1 1.6 0.1 2.5 0.1 1.75 0.1 0.3 0.05 5.5 0.1 5 3.5 0.05 8 .0 0.3 1.75 0.1 1.5 +0.1 -0 3.3 0.1 1.7 0.1 1 8 0.0 note: unit: mm 11.4 1 2.0 0.5 13.0 0.2 9.0 +0.3 -0 60.0 +1 -0
sheet no.: d1-a00801en 8 GL100MN3MPx GL100MN3MP1 (top view mount, 1500 pcs/reel) fig. 7 product insertion direction fig. 8 tape sh ape and dimension p u ll-o u t direction 4.0 0.1 2.0 0.05 4.0 0.1 1. 8 0.1 2.45 0.1 0.3 0.05 5.5 0.1 5 3.5 0.05 8 .0 0.3 1.75 0.1 3.3 0.1 1.5 +0.1 -0
sheet no.: d1-a00801en 9 GL100MN3MPx fig. 9 reel shape and dimension fig. 10 product insertion direction 1 8 0.0 note: unit: mm 11.4 1 2.0 0.5 13.0 0.2 9.0 +0.3 -0 60.0 +1 -0 p u ll-o u t direction
important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp?s devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristi cs, data materials, struc- ture, and other contents described herein at any time without notice in order to im prove design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment (terminal) --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to en sure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliabilty such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- v arious safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability an d safety such as: --- space applications --- telecommunication equipment (trunk lines) --- nuclear power control equipment --- medical and other life support equipment (e.g. scuba) if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. sheet no.: d1-a00801en 10 GL100MN3MPx
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